UNITED STATES PATENTS:

• Patent No. 5,461,196, “Low Temperature Co-fired Ceramic (LTCC) High-Density Interconnect Package with Circuitry in the Cavity Walls,” issued October 24, 1995.
• Patent No. 5,184,095, "Constant Impedance Transition Between Transmission Structures of Different Dimensions," issued February 2, 1993.
• Patent No. 5,170,140, "Diode Patch Phase Shifter Insertable into a Waveguide," issued December 8, 1992.
• Patent No. 5,150,088, "Stripline Shielding Techniques in Low Temperature Co-Fired Ceramics," issued September 22, 1992.



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