Tearing in Bond Graphs With Dependent Storage Elements



In a previous paper, we have shown that information about possible tearing variables added to a Bond Graph (BG) with dependent storage elements can be exploited by a program like Dymola, if the stores are replaced by a so-called resistive companion model originally introduced in integrated circuit analysis.

In this paper, it is shown how tearing information added to a BG with causal paths between stores of the same type can be exploited directly by a program like Dymola, allowing for a mixed symbolic and numerical solution of the underlying Differential Algebraic Equation (DAE) system. For didactic reasons, the method is explained by means of some fairly small examples. Nevertheless, it is quite general.

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